Researchers in China have created the most advanced microprocessor yet made from a two-dimensional material, boasting 5931 transistors crafted from molybdenum disulfide—just three atoms thick, according to IEEE Spectrum. This compound, composed of a molybdenum layer between two sulphur layers, is seen as a promising successor to silicon due to its atomic-scale thinness and high efficiency.
The new microprocessor could have groundbreaking implications across a multitude of industries and is being closely watched by other researchers across the world.
The chip, named RV32-WUJI, runs on the open-source RISC-V architecture, capable of executing standard 32-bit instructions. Built on an insulating sapphire base, it features a newly developed cell library containing 25 logic gate types, allowing it to perform basic computational functions like AND and OR. Compared to previous 2D circuits—which only managed 156 transistors—this development marks a significant milestone.
Despite operating at just 1 kilohertz and consuming 0.43 milliwatts, RV32-WUJI showcases the feasibility of building functional microprocessors from 2D materials using existing CMOS fabrication processes. The team reached a 99.77% manufacturing yield, using machine learning to optimise each production step—even with lab-level resources.
This progress comes amid growing limitations in traditional silicon chips, which struggle with issues like power leakage and size constraints. Two-dimensional semiconductors offer a potential path forward, not only in performance but in integration density. The researchers aim to further shrink the transistor channel length from 3 micrometres using improved lithography.
The team is now exploring uses in edge computing and smart sensing—areas where compact, efficient chips are critical.
This development marks more than just a lab experiment—it’s a blueprint for what’s possible. With scalable fabrication and AI-driven optimisation, 2D materials may be closer than expected to practical use, especially in areas where silicon struggles to keep up with demands for efficiency and miniaturisation.